Global Semiconductor Wafer Polishing and Grinding Equipment Market Growth, Share, Size, Trends and Forecast (2025 - 2031)

• In June 2022, Applied Materials announced the acquisition of Picosun Oy, a Finnish semiconductor equipment company. This strategic move aims to enhance Applied Materials' ICAPS (IoT, Communications, Automotive, Power, and Sensors) product offerings and deepen customer engagements by integrating Picosun's advanced atomic layer deposition (ALD) technology into its portfolio.

• In February 2022, Revasum secured a growth capital facility from SQN Venture Partners, LLC, valued at up to USD 8 million. This debt financing is intended to accelerate the development of new products and provide working capital to support the company's rapid growth, allowing Revasum to expand its capabilities and market reach.

The global semiconductor wafer polishing and grinding equipment market is segmented into types, applications, and regions, each playing a crucial role in the overall market dynamics. By type, the market is divided into polishing equipment and grinding equipment. Polishing equipment is essential for achieving the required smoothness and flatness on the wafer surface, which is critical for the performance of semiconductor devices. On the other hand, grinding equipment is used for thinning the wafers, making them suitable for various applications. The increasing demand for miniaturized electronic devices has significantly boosted the demand for both types of equipment, with a notable emphasis on advanced polishing technologies to meet the stringent quality standards of the semiconductor industry.

The market is segmented into memory, logic, MEMS, power devices, and others. The memory segment, which includes DRAM and NAND flash, holds a substantial share due to the growing need for data storage solutions in consumer electronics, data centers, and cloud computing. The logic segment, encompassing processors and integrated circuits, is also experiencing significant growth, driven by advancements in computing technologies and the increasing integration of AI and machine learning. MEMS (Micro-Electro-Mechanical Systems) and power devices are gaining traction as well, particularly in automotive and industrial applications, where the demand for high-performance and reliable semiconductor components is escalating. This diverse application spectrum underscores the versatility and critical importance of polishing and grinding equipment in the semiconductor manufacturing process.

The market is analyzed across North America, Europe, Asia-Pacific, and the Rest of the World. Asia-Pacific dominates the market due to the presence of major semiconductor manufacturing hubs in countries like China, Japan, South Korea, and Taiwan. These countries are home to some of the world’s largest semiconductor foundries and integrated device manufacturers (IDMs), driving the demand for advanced wafer polishing and grinding equipment. North America and Europe also hold significant market shares, driven by technological advancements and substantial investments in semiconductor R&D and manufacturing. The regional analysis highlights the strategic importance of these markets in sustaining the growth momentum of the global semiconductor wafer polishing and grinding equipment industry.

Global Semiconductor Wafer Polishing and Grinding Equipment Segment Analysis

In this report, the Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by Equipment,Product, End User, and Geography.

Global Semiconductor Wafer Polishing and Grinding Equipment Segmentation by Equipment

The Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by Equipment Into Deposition, Lithography, Ion Implant, Etching, and Cleaning.

In this report, the Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by equipment type into polishing equipment and grinding equipment. Polishing equipment is essential for achieving the required smoothness and flatness on the wafer surface, which is critical for the performance and reliability of semiconductor devices. This segment has seen significant growth due to the increasing demand for high-quality and miniaturized semiconductor components used in various advanced technologies such as AI, ML, and IoT. Advanced polishing techniques are crucial for ensuring the wafers meet the stringent specifications required for these applications.

The grinding equipment segment is equally important as it is used for thinning the semiconductor wafers to the desired thickness, making them suitable for various applications, including memory, logic, and power devices. Grinding equipment is vital in the manufacturing process as it prepares the wafers for subsequent polishing and ensures that they are of uniform thickness, which is essential for device performance and yield. The growing demand for compact and efficient electronic devices has driven the need for precise and reliable grinding equipment, making this segment a critical component of the overall market.

Both polishing and grinding equipment are indispensable in the semiconductor manufacturing process, and their demand is influenced by the rapid advancements in semiconductor technology and the increasing complexity of electronic devices. As the semiconductor industry continues to innovate and push the boundaries of performance, the need for high-precision wafer processing equipment will only grow. This segmentation highlights the specialized roles that polishing and grinding equipment play in meeting the evolving needs of the semiconductor market, ensuring the production of high-quality and reliable semiconductor components.

Global Semiconductor Wafer Polishing and Grinding Equipment Segmentation by Product

The Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by Product Into Single Side Polishing Machine and Double Side Polishing Machine.

The market for polishing machines can be analyzed based on the segmentation of single-side polishing machines and double-side polishing machines. Each type caters to specific industrial needs and has distinct applications, driving its demand in different sectors.

Single-side polishing machines are widely used in industries where precision surface finishing is required on one side of the material. These machines are commonly found in semiconductor manufacturing, optics, and metal processing. The increasing demand for high-quality surface finishing in electronics and automotive industries has fueled the growth of this segment. Additionally, single-side polishing machines are generally more cost-effective and require lower maintenance compared to double-side machines, making them a preferred choice for small and medium-sized enterprises. Their flexibility in handling various materials, including metals, ceramics, and glass, further enhances their market appeal.

On the other hand, double-side polishing machines offer higher efficiency and uniformity in material finishing by simultaneously working on both sides of a component. This capability makes them ideal for applications in industries where precision and parallelism are critical, such as aerospace, medical devices, and high-end electronics. These machines are particularly beneficial for the production of silicon wafers, optical lenses, and advanced ceramics, where maintaining tight tolerances and reducing processing time are essential. The growing adoption of automation and advancements in polishing technology have contributed to the increased demand for double-side polishing machines, despite their higher initial investment costs.

Both segments are witnessing technological advancements that enhance operational efficiency and precision. The integration of automation, artificial intelligence, and real-time monitoring systems has improved the performance of these machines, reducing human intervention and ensuring consistent quality. The choice between single-side and double-side polishing machines depends largely on the specific requirements of the end-use industry, cost considerations, and the level of precision needed. With the expanding semiconductor and electronics industries, the demand for both types of machines is expected to grow, driven by the increasing need for superior surface finishing solutions.

Global Semiconductor Wafer Polishing and Grinding Equipment Segmentation by End User

The Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by End User Into Foundries, Memory Manufacturers, IDMs, and Others.

In this report, the Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by end user into semiconductor foundries, integrated device manufacturers (IDMs), and others such as research institutions and specialty manufacturers. Semiconductor foundries, which produce chips for other companies, represent a significant portion of the market due to the high demand for outsourced semiconductor manufacturing. Foundries rely heavily on advanced polishing and grinding equipment to produce high-quality wafers that meet the exact specifications of their clients, driving the need for continuous investment in cutting-edge technologies.

Integrated Device Manufacturers (IDMs), which design, manufacture, and sell their own semiconductor products, also constitute a substantial market segment. IDMs require high-precision polishing and grinding equipment to maintain control over the quality and performance of their semiconductor components. As IDMs strive to innovate and develop new products, the need for reliable and efficient wafer processing equipment becomes increasingly critical. This segment is particularly driven by the demand for advanced semiconductor devices used in consumer electronics, automotive applications, and industrial automation, where performance and reliability are paramount.

Other end users, such as research institutions and specialty manufacturers, also contribute to the market demand. Research institutions often require specialized polishing and grinding equipment for experimental and developmental purposes, focusing on pioneering new semiconductor technologies. Specialty manufacturers, which produce customized semiconductor components for niche applications, rely on precision equipment to meet specific requirements. This diverse range of end users highlights the broad applicability and importance of advanced wafer processing equipment across various sectors, driving overall market growth and innovation.

Global Semiconductor Wafer Polishing and Grinding Equipment Market, Segmentation by Geography

In this report, the Global Semiconductor Wafer Polishing and Grinding Equipment Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East and Africa and Latin America.

Global Semiconductor Wafer Polishing and Grinding Equipment Market Share (%), by Geographical Region, 2024

In the Global Semiconductor Wafer Polishing and Grinding Equipment Market, the Asia-Pacific region holds the largest market share, accounting for approximately 60% in the past year. This dominance is driven by the presence of major semiconductor manufacturing hubs in countries like China, Japan, South Korea, and Taiwan. These countries are home to some of the world’s largest semiconductor foundries and integrated device manufacturers (IDMs), which invest heavily in advanced wafer polishing and grinding equipment to maintain their competitive edge. The rapid expansion of consumer electronics, automotive, and industrial applications in the region further propels the demand for high-quality semiconductor components.

North America holds the second-largest market share, representing around 20% of the global market. The region's robust semiconductor industry is supported by significant investments in research and development, as well as the presence of leading technology companies. The United States, in particular, is a major player in the semiconductor market, with a strong focus on innovation and advanced manufacturing processes. The growing demand for AI, IoT, and 5G technologies in North America drives the need for precise and reliable wafer polishing and grinding equipment, contributing to the region's substantial market share.

Europe accounts for approximately 15% of the market share, with a strong presence in high-tech manufacturing and a focus on sustainable and efficient semiconductor production. Countries like Germany, the Netherlands, and France are key players in the European semiconductor market, emphasizing the development of advanced technologies and automation. The region’s emphasis on green manufacturing practices and energy-efficient technologies further stimulates the demand for advanced wafer processing equipment. The remaining 5% of the market share is distributed among other regions, including the Middle East, Africa, and Latin America, where emerging markets are gradually increasing their investments in semiconductor manufacturing capabilities.

This report provides an in depth analysis of various factors that impact the dynamics of Global Semiconductor Wafer Polishing and Grinding Equipment Market. These factors include; Market Drivers, Restraints and Opportunities

Drivers, Restraints and Opportunity

Drivers

• Rising demand for semiconductors
• Growth in consumer electronics
• Advancements in automotive technology

• Expansion of IoT applications - The expansion of IoT applications is a significant driver for the global semiconductor wafer polishing and grinding equipment market. IoT, which connects everyday devices to the internet, requires highly efficient and reliable semiconductor components to function seamlessly. As more devices become "smart" and interconnected, the demand for semiconductors with superior performance and miniaturized designs has surged. This trend necessitates advanced wafer polishing and grinding technologies to achieve the precision and quality required for these high-performance semiconductor components.

  IoT applications span various industries, including healthcare, agriculture, smart homes, and industrial automation, each contributing to the increasing demand for semiconductors. In healthcare, IoT devices such as wearable health monitors and remote diagnostic tools rely on sophisticated semiconductor technology for accurate data collection and processing. Similarly, smart homes are equipped with IoT devices like smart thermostats, security systems, and voice assistants, all of which depend on advanced semiconductors. In industrial automation, IoT sensors and devices enable real-time monitoring and control of manufacturing processes, enhancing efficiency and productivity.

  The rapid proliferation of IoT devices has led to a substantial increase in the production of semiconductor wafers, driving the need for state-of-the-art polishing and grinding equipment. These machines are essential for ensuring the wafers meet the stringent specifications required for IoT applications, such as low power consumption, high processing speed, and miniaturization. As IoT technology continues to evolve and expand, the semiconductor industry will increasingly rely on advanced wafer processing equipment to maintain the high standards necessary for the next generation of connected devices.

Restraints

• High equipment costs
• Technical complexities
• Stringent quality standards

• Supply chain disruptions - Supply chain disruptions pose significant challenges to the global semiconductor wafer polishing and grinding equipment market. These disruptions can stem from various factors, including natural disasters, geopolitical tensions, and pandemics, which can lead to delays in the production and delivery of essential components. Such delays can halt or slow down semiconductor manufacturing processes, causing a ripple effect throughout the industry. Given the critical role of polishing and grinding equipment in producing high-quality semiconductor wafers, any interruption in the supply chain can severely impact the availability and performance of these essential machines.

  One of the major consequences of supply chain disruptions is the shortage of raw materials and key components needed for manufacturing wafer polishing and grinding equipment. This scarcity can drive up costs and force manufacturers to seek alternative suppliers, potentially compromising the quality and reliability of the equipment. Additionally, disruptions can lead to longer lead times for equipment delivery, affecting semiconductor manufacturers' ability to meet production deadlines and market demand. The semiconductor industry operates on tight schedules to keep up with technological advancements and consumer expectations, making timely access to equipment crucial.

  Supply chain disruptions can also impact the maintenance and servicing of existing polishing and grinding equipment. Delays in obtaining replacement parts or specialized services can lead to extended downtime for semiconductor manufacturing facilities, reducing overall productivity and efficiency. To mitigate these risks, companies in the semiconductor wafer polishing and grinding equipment market are increasingly focusing on diversifying their supply chains, investing in local manufacturing capabilities, and building more robust relationships with suppliers. These strategies are essential to ensure resilience and continuity in the face of potential disruptions, thereby maintaining the steady growth and innovation within the semiconductor industry.

Opportunities

• Technological advancements
• Increasing R&D investments
• Expansion in emerging markets

• Growing AI and ML applications - The growing applications of Artificial Intelligence (AI) and Machine Learning (ML) are significantly driving the demand for semiconductor wafer polishing and grinding equipment. AI and ML technologies require high-performance semiconductor components to process vast amounts of data quickly and efficiently. These components must be manufactured with exceptional precision and quality, necessitating advanced wafer polishing and grinding techniques. As AI and ML become integral to various sectors, including healthcare, finance, automotive, and consumer electronics, the need for state-of-the-art semiconductor fabrication equipment continues to escalate.

  AI and ML applications in data centers and cloud computing further highlight the importance of semiconductor technology. Data centers, which serve as the backbone for AI and ML operations, require powerful processors and memory chips capable of handling intensive computational tasks. This demand drives the production of advanced semiconductor wafers, which in turn relies on precise polishing and grinding equipment to meet the stringent performance and reliability standards. The rapid growth of AI and ML technologies accelerates the development and adoption of innovative semiconductor manufacturing processes, ensuring that the components can support the computational requirements of these advanced applications.

  The proliferation of AI and ML in consumer devices, such as smartphones, smart home devices, and wearables, underscores the need for miniaturized and efficient semiconductor components. These devices require compact, low-power chips with high processing capabilities, achievable through advanced wafer processing techniques. As AI and ML technologies continue to evolve, the semiconductor industry must keep pace with the increasing complexity and performance demands. This ongoing evolution drives continuous investments in research and development of cutting-edge wafer polishing and grinding equipment, ensuring that the semiconductor components can support the next generation of AI and ML applications.

Key players in Global Semiconductor Wafer Polishing and Grinding Equipment Market include :

• Applied Materials
• Ebara Corporation
• Lapmaster Wolters GmbH
• Logitech
• Entrepix
• Revasum
• Tokyo Seimitsu
• Logomatic GmbH

In this report, the profile of each market player provides following information:

• Company Overview and Product Portfolio
• Key Developments
• Financial Overview
• Strategies
• Company SWOT Analysis