Global CMP Equipment Market Growth, Share, Size, Trends and Forecast (2025 - 2031)

The Global CMP Equipment Market has been segmented by Wafer Size, End-User and Geography, each contributing to the market's expansion in the semiconductor industry. In terms of wafer size, the market is primarily divided into 200mm, 300mm, and 450mm wafers. The 300mm wafer segment is the dominant segment, as it is widely used in the production of advanced integrated circuits (ICs), driven by the demand for faster, more powerful electronics. 200mm wafers are still important in the production of legacy ICs and certain specialized devices, while 450mm wafers are emerging as the next generation of wafer size, though adoption has been slow due to technological challenges and high costs.

The end-user segment of the market includes semiconductor manufacturers, foundries, and integrated device manufacturers (IDMs), each with different needs for CMP equipment. Semiconductor manufacturers rely heavily on CMP equipment to achieve planarization and ensure precise layer thinning in chip production. Foundries, which offer semiconductor fabrication services to fabless companies, represent a large portion of the market as they require high-precision CMP tools for diverse semiconductor applications. IDMs, which handle both the design and manufacturing of chips, use CMP tools for efficient wafer processing to meet the demands of advanced semiconductor technologies. As the need for smaller, faster, and more powerful semiconductor devices continues to rise, CMP equipment becomes essential for ensuring the quality and performance of chips.

Geographically, the global CMP equipment market is experiencing strong growth in Asia-Pacific, North America, and Europe. Asia-Pacific is the largest and fastest-growing market, with countries like China, South Korea, Taiwan, and Japan being major players in semiconductor manufacturing. These nations' strong semiconductor industry bases and increasing demand for electronics are key factors driving the market's growth in the region. North America follows closely, particularly in the United States, where major semiconductor companies are focused on developing cutting-edge technologies. Europe also plays a significant role, although it is smaller compared to the other regions. The growing demand for advanced semiconductor devices across these regions, driven by the rise of technologies like 5G, AI, and IoT, is expected to continue fueling the growth of the CMP equipment market worldwide.

Global CMP Equipment Segment Analysis

In this report, the Global CMP Equipment Market has been segmented by Wafer Size, End-User and Geography.

Global CMP Equipment Market, Segmentation by Wafer Size

The Global CMP Equipment Market has been segmented by Wafer Size into 300mm, 200mm and 150mm.

300mm wafers dominate the high-end of the CMP equipment market. These larger wafers are favored for their ability to achieve higher semiconductor yields and reduce manufacturing costs per chip. The adoption of 300mm wafers has been driven by the industry's continuous pursuit of efficiency and scalability in semiconductor manufacturing. As demand grows for advanced technologies like 5G, AI, and IoT devices, the need for CMP equipment capable of handling 300mm wafers increases, emphasizing precision and uniformity across larger surfaces.

In contrast, 200mm wafers represent a mature segment within the CMP equipment market. While production volumes for 200mm wafers have stabilized, they remain essential for manufacturing a wide range of semiconductor components. This segment benefits from established manufacturing processes and a robust market for legacy semiconductor applications. CMP equipment tailored for 200mm wafers continues to play a crucial role in sustaining production for automotive electronics, industrial applications, and certain consumer electronics segments.

The 150mm wafer segment represents the smallest category in terms of wafer size for CMP equipment. Despite its smaller footprint, the 150mm wafer market remains relevant primarily in niche applications, including MEMS (Micro-Electro-Mechanical Systems) devices and specialized sensors. CMP equipment designed for 150mm wafers often emphasizes flexibility and precision to meet the specific requirements of these emerging technologies. As demand grows for miniaturized sensors and IoT components, the 150mm wafer segment may see incremental growth opportunities, driven by innovations in semiconductor materials and manufacturing processes.

Overall, the global CMP equipment market is shaped by the distinct requirements and growth trajectories of each wafer size segment. While 300mm wafers lead in terms of technological advancement and volume production, 200mm wafers maintain stability in mature markets, and 150mm wafers offer opportunities in specialized applications. Manufacturers and suppliers in the CMP equipment industry must navigate these varied segments to capitalize on evolving semiconductor demands and technological advancements.

Global CMP Equipment Market, Segmentation by End-User

The Global CMP Equipment Market has been segmented by End-User into Pureplay Foundries and IDMs.

In the global CMP (Chemical Mechanical Planarization) equipment market, Pureplay Foundries and IDMs (Integrated Device Manufacturers) represent distinct segments driving demand and shaping market dynamics. Pureplay Foundries, which specialize in manufacturing semiconductor wafers for multiple clients, are pivotal consumers of CMP equipment. Their operations are characterized by high-volume production of advanced integrated circuits (ICs) for diverse applications such as consumer electronics, automotive, and industrial sectors. The relentless pursuit of smaller transistor sizes and higher chip densities necessitates precise CMP processes to achieve optimal planarization and uniformity, thereby boosting demand for advanced CMP equipment tailored to their stringent requirements.

On the other hand, IDMs, which design, manufacture, and sell their own semiconductor devices, also constitute a significant segment for CMP equipment. IDMs typically focus on developing proprietary technologies and products tailored to specific market niches. Their demand for CMP equipment is driven by the need to maintain high-quality standards and achieve precise device characteristics across various semiconductor platforms. IDMs often invest in CMP equipment that offers flexibility and customization capabilities to meet their unique manufacturing needs, ensuring consistent performance and reliability in their product offerings.

Both Pureplay Foundries and IDMs face common challenges in the CMP equipment market, such as managing escalating production costs, optimizing process efficiencies, and addressing environmental and safety concerns associated with chemical usage. However, they also present distinct opportunities. For Pureplay Foundries, opportunities lie in expanding production capacities driven by rising demand for semiconductor devices across global markets. Meanwhile, IDMs capitalize on their ability to innovate and differentiate through specialized semiconductor designs and niche markets, driving demand for tailored CMP solutions that enhance device performance and competitiveness.

Looking forward, the growth trajectory of the CMP equipment market for Pureplay Foundries and IDMs will continue to be influenced by advancements in semiconductor technologies, shifts in consumer electronics trends, and regulatory landscapes governing semiconductor manufacturing. Strategic investments in research and development, alongside partnerships with technology providers, will be crucial for both segments to sustain growth, enhance operational efficiencies, and meet evolving market demands effectively.

Global CMP Equipment Market, Segmentation by Geography

In this report, the Global CMP Equipment Market has been segmented by Geography into five regions; North America, Europe, Asia Pacific, Middle East and Africa and Latin America.

Global CMP Equipment Market Share (%), by Geographical Region, 2024

The global CMP (Chemical Mechanical Planarization) equipment market is poised for significant growth across various geographical regions from 2020 to 2030. In North America, the market is expected to thrive driven by robust technological advancements and a strong presence of semiconductor manufacturing facilities. The region’s focus on innovation in electronics, including AI and IoT applications, will bolster demand for CMP equipment. Similarly, Europe is set to witness steady growth, supported by increasing investments in semiconductor research and development, especially in countries like Germany and the Netherlands. The shift towards advanced packaging solutions and the automotive electronics sector will further contribute to market expansion in this region.

Asia Pacific is anticipated to dominate the global CMP equipment market throughout the forecast period. Countries such as China, Japan, South Korea, and Taiwan are pivotal players in semiconductor manufacturing, driving substantial demand for CMP equipment. The region benefits from a dense network of foundries and a growing consumer electronics market, fueling continuous technological upgrades and production scaling. Additionally, the Middle East and Africa are projected to experience moderate growth, propelled by rising investments in infrastructure development and increasing adoption of electronic devices across various sectors.

Latin America, although a smaller market compared to other regions, is expected to witness gradual growth in CMP equipment adoption. The region’s expanding automotive industry and investments in telecommunications infrastructure are key factors driving this growth. Overall, from 2020 to 2030, the global CMP equipment market is set to expand across North America, Europe, Asia Pacific, Middle East and Africa, and Latin America, driven by technological advancements, semiconductor industry growth, and increasing applications in diverse sectors.

This report provides an in depth analysis of various factors that impact the dynamics of Global CMP Equipment Market. These factors include; Market Drivers, Restraints and Opportunities.

Drivers, Restraints and Opportunity

Drivers

• Technological Advancements in CMP Processes
• Increasing Semiconductor Wafer Sizes

• Growing Demand for Consumer Electronics-The growing demand for consumer electronics is a pivotal driver influencing the Global CMP (Chemical Mechanical Planarization) Equipment Market. Consumer electronics, ranging from smartphones to tablets, smart TVs, and wearable devices, continue to evolve with demands for smaller, more powerful semiconductor components. These devices rely heavily on advanced semiconductor manufacturing processes that require CMP equipment for precise planarization and surface preparation. As consumer expectations for performance, battery life, and connectivity increase, so does the demand for semiconductors produced using CMP equipment capable of delivering high yields and uniformity.

  The proliferation of IoT (Internet of Things) devices and smart home technologies further amplifies the demand for semiconductors and, consequently, CMP equipment. These technologies rely on compact yet efficient semiconductor components, driving manufacturers to invest in advanced CMP solutions to meet stringent performance requirements. The competitive landscape of consumer electronics pushes manufacturers to adopt cutting-edge semiconductor manufacturing processes, where CMP plays a crucial role in achieving the necessary precision and reliability.

  The expansion of 5G networks worldwide is fostering additional demand for consumer electronics capable of supporting faster data speeds and lower latency. This technological shift requires semiconductor devices manufactured with high levels of integration and efficiency, underlining the importance of CMP equipment in ensuring optimal semiconductor performance. As 5G continues to roll out globally, the demand for CMP equipment is expected to rise, driven by the need to produce semiconductors that meet the stringent performance demands of next-generation communication technologies.

  The consumer electronics sector represents a dynamic growth area for the CMP equipment market. The ongoing innovation and adoption of new technologies in smartphones, wearables, and other electronic devices drive continuous advancements in semiconductor manufacturing processes. CMP equipment manufacturers are poised to capitalize on these trends by developing and supplying advanced solutions that meet the evolving demands of the consumer electronics industry worldwide.

Restraints

• Environmental and Safety Concerns
• Cyclic Nature of Semiconductor Industry

• Challenges in CMP for New Materials-Challenges in CMP (Chemical Mechanical Planarization) for new materials represent a significant hurdle in the global CMP equipment market. As semiconductor manufacturers push the boundaries of material science to enhance device performance and reduce size, CMP processes must adapt to accommodate these new materials. One of the primary challenges lies in the varying mechanical and chemical properties of these novel materials, which can differ significantly from traditional silicon substrates. This disparity complicates the development of CMP slurries and polishing pads optimized for achieving uniform planarity and minimizing defects during the polishing process.

  The introduction of new materials often necessitates adjustments in the CMP equipment itself. The mechanical stress exerted during polishing can vary depending on the material's hardness, brittleness, and thermal conductivity. This variability requires CMP equipment to be capable of precise control and customization to avoid damage and ensure consistent results across different materials. Manufacturers must invest in research and development to innovate equipment designs that can handle these diverse material properties effectively.

  The integration of new materials into semiconductor manufacturing processes introduces challenges related to process compatibility and yield management. CMP processes must be finely tuned to prevent issues such as dishing, erosion, or surface defects that could compromise device functionality. Achieving the required level of precision and uniformity becomes increasingly complex as materials with unique chemical compositions and structures are introduced, demanding continuous refinement and adaptation of CMP equipment and processes.

  As semiconductor manufacturers strive for higher yields and lower production costs, the adoption of new materials must be accompanied by improvements in CMP efficiency and throughput. Enhancing the rate at which these materials can be polished without sacrificing quality remains a critical challenge. CMP equipment providers face the ongoing task of balancing speed, precision, and reliability in their offerings to meet the evolving demands of semiconductor fabrication technologies incorporating new and advanced materials. Addressing these challenges effectively will be essential for sustaining growth and innovation in the global CMP equipment market.

Opportunities

• Rapid Technological Innovations
• Increasing Focus on Green CMP Solutions

• Expansion of Semiconductor Foundries-The expansion of semiconductor foundries represents a significant opportunity for the global CMP (Chemical Mechanical Planarization) equipment market. Foundries play a crucial role in semiconductor manufacturing by offering production facilities for integrated circuits (ICs) on behalf of fabless semiconductor companies. As these foundries expand their production capacities, driven by increasing demand for semiconductors across various industries including consumer electronics, automotive, and industrial applications, there is a parallel rise in the demand for CMP equipment. These machines are essential for achieving the precise planarization required in semiconductor fabrication processes, ensuring high yields and quality.

  The growth in semiconductor foundries, particularly in regions like Asia-Pacific, has been propelled by several factors. Firstly, the shift towards larger wafer sizes (such as 300mm and beyond) necessitates advanced CMP equipment capable of handling these larger substrates efficiently. Foundries are investing in state-of-the-art CMP tools to maintain competitiveness and meet the stringent requirements of high-volume semiconductor production. Moreover, the increasing complexity of semiconductor designs and the drive for miniaturization further underscore the need for sophisticated CMP equipment that can deliver uniform and defect-free surfaces across large-scale manufacturing operations.

  The expansion of semiconductor foundries is driven by technological advancements and the pursuit of economies of scale. Foundries are adopting new materials, processes, and packaging technologies to meet the evolving demands of their customers. This evolution translates into opportunities for CMP equipment manufacturers to innovate and develop solutions tailored to these new requirements. The presence of foundries in emerging markets also contributes to the global expansion of the CMP equipment market, as these regions witness increased investments in semiconductor manufacturing infrastructure.

  The expansion of semiconductor foundries presents a fertile ground for CMP equipment providers to expand their market footprint. By aligning their offerings with the needs of foundries for enhanced process control, higher throughput, and improved cost-effectiveness, CMP equipment manufacturers can capitalize on the growing demand and contribute to the advancement of semiconductor manufacturing capabilities worldwide.

Key players in Global CMP Equipment Market include:

• Applied Materials Inc.
• Entegris Inc.
• Ebara Corporation
• Lapmaster Wolters Gmbh
• Dupont De Nemours Inc.
• Fujimi Incorporated
• Revasum Inc.
• Resonac Holdings Corporation (Showa Denko Materials)
• Okamoto Corporation
• Fujifilm Corporation (Fujifilm Holdings Corporation)
• Tokyo Seimitsu Co. Ltd (Accretech Create Corp.)

In this report, the profile of each market player provides following information:

• Company Overview and Product Portfolio
• Key Developments
• Financial Overview
• Strategies
• Company SWOT Analysis